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Brief Introduction from Features and Applications of Resin Bond Diamond Grinding Wheels
1. Features of Resin Diamond Grinding Wheels.
(1).Very Good Polishing Performance.
(2).High Elasticity, Soft
(3).Poor Heat Resistance, heat acid resistance and alkali resistance.
(4).Poor holding for abrasive grains.
(5).Good Self-sharpening.
(6).High grinding efficiency.
(7).Low grinding temperature, low grinding roughness.
(8).Used for tungsten carbide, PDC, Polycrystalline, etc. 

2. Why Choosing Resin Bond for Diamond Grinding Wheels.
(1).Good Binding  
The Bond can be evenly distributed on the surface of abrasives, and hold abrasive grains firmly in the resin bond diamond grinding wheel, and it can be firmly bonded to the matrix, it can make the abrasives do not fall off easily in the early, and avoid the separation of the bond and the matrix to ensure product safety.
 
(2). High bond strength
The strength of bond directly affects the grinding efficiency, consumption, work piece quality and safety performance of grinding wheel.
 
(3). High grinding efficiency, good wear resistance, and good finish.
Resin bond has elasticity and brittleness, so it has good self-sharpening and not block, but poor wear resistance.
Therefore, resin bond diamond grinding wheels should have both high grinding efficiency and high wear resistance under the condition of ensuring the requirement of surface roughness, the bond formula is very important of the wheel, resin bond diamond grinding wheel with both grinding efficiency and wear resistance can meet the requirements of processing and reduce the cost.
 
(4). Good Heat Resistance   
If the heat resistance of the resin bond is poor, the grinding wheel will not bear high temperature and consume quickly and make the wheel burns and cracks, because of the high grinding heat. Therefore, should choose the bond with good heat resistance and add appropriate fillers to improve the heat resistance for resin bond diamond grinding wheel. At the same time, wet grinding with coolant is used to improve the durability of the grinding wheel if dry grinding, the feed amount is as small as possible to improve the durability.

 
 
3. Applications of Resin Bond Diamond Grinding Wheels.
(1).The Resin Bond Diamond Grinding Wheels widely used in super finish grinding polycrystalline diamond and Cubic Boron Nitride Tools.
(2).And Used for Materials of Tungsten Carbide Tools, Automotive Glass, PDC, PCD, PCBN, Ceramics, Sapphire, Optical Glass, and Magnetic Materials.  
(3).Resin bond diamond grinding wheel with features of small grinding force, less grinding heat, good self-sharpening, high efficiency, and high surface finish. Mainly used for cutting, finish grinding, Semi-finish grinding, sharpening, and polishing.
(4).Resin Bond Diamond Grinding Wheels are widely used in processing precious ceramic, semiconductor materials, magnetic materials, and metal materials.
(5).Resin Bond Diamond Grinding Wheel with wide application in the grinding of tungsten carbide circular saw blade.
The grinding edge is smooth, and it is sharp and has a long service life. 
(6). Wide Applications in processing precious ceramic, semiconductor materials, magnetic materials, and metal materials.
(7).Resin Bond Diamond Grinding Wheel is widely used in the grinding of tungsten carbide circular saw blade.
(8). Wide Applications in the Business Field of finish grinding tungsten carbide tools and can obtain high finish of the work piece. It can obtain high surface quality in grinding natural diamond.
(9). Resin bond diamond lapping wheel is used for display screen processing instead of traditional free abrasive lapping, by improve the processing efficiency of the display screen and surface quality, and reduce the cost, it can precision grind the IC silicon wafer. With features of high material removal rate and good surface roughness.